The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

With the continuous emergence of various advanced packaging technologies such as copper interconnection and 3-D technology, it is essential to efficiently accurately investigate thermal analysis high-performance, high-power complicated electronic devices better design heat dissipation structures. However, multiscale transient complex by existing numerical methods still a challenge. In this work, domain decomposition method (DDM) with adaptive time step for integrated circuits (ICs) proposed tackle problem. By flexible mesh generation automatically changes based on posteriori errors, new significantly improves computational efficiency. Some illustrative examples are presented verify accuracy efficiency considering transfer conduction, natural convection radiation boundaries.